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Lihlahisoa

High recycling Blasting Media boholo bohle silicon carbide phofo e ntle gsic bakeng sa ho bentša le ho sila


  • Mmala :Botala
  • Litaba:>98%
  • Basic Mineral:α-SiC
  • Sebopeho sa kristale:kristale ea hexagonal
  • Mohs hardness:3300kg/mm3
  • Boima ba 'nete:3.2g/mm
  • Boima ba bongata:1.2-1.6g/mm3
  • Matla a khoheli a khethehileng:3.20-3.25
  • Lintlha tsa Sehlahisoa

    KOPO

    Selelekela sa Green Silicon Carbide

    Green silicon carbide powder ke thepa ea boleng bo holimo ea abrasive e sebelisetsoang lits'ebetso tse fapaneng joalo ka ho bentsa le sandblasting.E tsebahala ka ho thatafala ha eona, bokhoni ba eona ba ho itšeha bo tsotehang, le matla a holimo.Silicon carbide e tala e hlahisoa ka ho futhumatsa motsoako oa lehlabathe la silica le carbon ho mocheso o phahameng ka sebōping sa motlakase.Phello ke thepa ea kristale e nang le 'mala o motala o motle.

    monate (58)
    monate (52)
    GSic (6)

    Thepa ea 'mele ea Silicon Carbide e tala

     

    Thepa ea nama
    Sebopeho sa kristale Hexagonal
    Boima ba bongata 1.55-1.20g/cm3
    Boima ba lijo-thollo 3.90g/cm3
    Mohs Hardness 9.5
    Knoop Hardness 3100-3400 Kg/mm2
    Shatter matla 5800 kPa·cm-2
    Mmala Botala
    Sebaka se qhibilihang 2730ºC
    Thermal conductivity (6.28-9.63)W·m-1·K-1
    Mohala oa katoloso ea coefficient (4 - 4.5)*10-6K-1(0 - 1600 C)
    Boholo Kabo ea lijo-thollo Sebopeho sa Lik'hemik'hale(%)
      D0 ≤ D3 ≤ D50 D94 ≥ SiC ≥ FC ≤ Fe2O3≤
    #700 38 30 17±0.5 12.5 99.00 0.15 0.15
    #800 33 25 14±0.4 9.8 99.00 0.15 0.15
    #1000 28 20 11.5±0.3 8.0 98.50 0.25 0.20
    #1200 24 17 9.5±0.3 6.0 98.50 0.25 0.20
    #1500 21 14 8.0±0.3 5.0 98.00 0.35 0.30
    #2000 17 12 6.7±0.3 4.5 98.00 0.35 0.30
    #2500 14 10 5.5±0.3 3.5 97.70 0.35 0.33
    #3000 11 8 4.0±0.3 2.5 97.70 0.35 0.33

     


  • E fetileng:
  • E 'ngoe:

    1. Ho sila le ho seha: ho sila ka nepo ha litšepe tse thata, lisebelisoa tsa ceramic le likhalase
    2. Ho leotsa le ho otlolla: ho leotsa le ho holisa lisebelisoa tsa ho seha joalo ka lithipa, lichesele le mahare.
    3. Abrasive Blasting: ho lokisa holim'a metsi, ho hloekisa le ho kenya lisebelisoa
    4. Ho bentša le ho Lapping: ho bentša ka nepo ha lilense, liipone, le ho belisoa ha semiconductor wafer
    5. Wire Sawing: liphaphatha tsa silicon, mahakoe le lirafshoa
    6. Indasteri ea Refractory le Ceramic: ho etsa li-crucibles, thepa ea ka tlung le likarolo tse ling tsa mocheso o phahameng.
    7. Indasteri ea Semiconductor:
    8. Lisebelisoa tsa Metallurgical

     

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