Ka lebaka la ho haella ha moissanite ea tlhaho, boholo ba silicon carbide ke maiketsetso.E sebelisoa e le abrasive, 'me morao tjena e le semiconductor le taemane simulant boleng lehakoe.Mokhoa o bonolo ka ho fetisisa oa ho etsa tlhahiso ke ho kopanya lehlabathe la silica le carbon ka seboping sa ho hanyetsa motlakase sa Acheson graphite mocheso o phahameng, pakeng tsa 1,600 ° C (2,910 ° F) le 2,500 ° C (4,530 ° F).Likaroloana tse ntle tsa SiO2 linthong tsa semela (mohlala, likhaka tsa raese) li ka fetoloa ho ba SiC ka ho futhumatsa khabone e feteletseng ho tsoa linthong tse phelang.Mosi oa silica, oo e leng sehlahisoa sa ho hlahisa tšepe ea silicon le li-alloys tsa ferrosilicon, le oona o ka fetoloa ho SiC ka ho futhumatsa ka graphite ho 1,500 °C (2,730 °F).
F12-F1200, P12-P2500
0-1mm, 1-3mm, 6/10, 10/18, 200mesh, 325mesh
Litlhaloso tse ling tse khethehileng li ka fanoa ka kopo.
Grit | Sic | FC | Fe2O3 |
F12-F90 | ≥98.50 | <0.20 | ≤0.60 |
F100-F150 | ≥98.00 | <0.30 | ≤0.80 |
F180-F220 | ≥97.00 | <0.30 | ≤1.20 |
F230-F400 | ≥96.00 | <0.40 | ≤1.20 |
F500-F800 | ≥95.00 | <0.40 | ≤1.20 |
F1000-F1200 | ≥93.00 | <0.50 | ≤1.20 |
P12-P90 | ≥98.50 | <0.20 | ≤0.60 |
P100-P150 | ≥98.00 | <0.30 | ≤0.80 |
P180-P220 | ≥97.00 | <0.30 | ≤1.20 |
P230-P500 | ≥96.00 | <0.40 | ≤1.20 |
P600-P1500 | ≥95.00 | <0.40 | ≤1.20 |
P2000-P2500 | ≥93.00 | <0.50 | ≤1.20 |
Grits | Boima ba Bongata (g/cm3) | Boima bo phahameng (g/cm3) | Grits | Boima ba Bongata (g/cm3) | Boima bo phahameng (g/cm3) |
F16 ~ F24 | 1.42 ~ 1.50 | ≥1.50 | F100 | 1.36 ~ 1.45 | ≥1.45 |
F30 ~ F40 | 1.42 ~ 1.50 | ≥1.50 | F120 | 1.34 ~ 1.43 | ≥1.43 |
F46 ~ F54 | 1.43 ~ 1.51 | ≥1.51 | F150 | 1.32 ~ 1.41 | ≥1.41 |
F60 ~ F70 | 1.40 ~ 1.48 | ≥1.48 | F180 | 1.31 ~ 1.40 | ≥1.40 |
F80 | 1.38 ~ 1.46 | ≥1.46 | F220 | 1.31 ~ 1.40 | ≥1.40 |
F90 | 1.38 ~ 1.45 | ≥1.45 |
Haeba u na le lipotso.Ka kopo ikutloe u lokolohile ho ikopanya le rona.