Selelekela le ts'ebeliso ea li-abrasives tsa daemane
Taemane ke ntho e nang le bothata bo boholo ka ho fetisisa. E na le bothata bo phahameng haholo, ho tsamaisa mocheso le ho hanyetsa ho tsofala, kahoo e sebelisoa haholo indastering ea ho khohlela. Ka nts'etsopele ea theknoloji ea indasteri,lintho tse qhetsolang taemaneli ntlafalitsoe ho tloha litaemaneng tsa tlhaho tsa setso ho ea litaemaneng tse fapaneng tsa maiketsetso le thepa e kopaneng e sebetsang, e leng karolo ea bohlokoa ea tšimo ea thepa e thata haholo, 'me li sebelisoa haholo liindastering tse ngata tse nang le lintlha tse phahameng tse kang ts'ebetso ea mechini, lisebelisoa tsa elektroniki, optics le matla a macha.
Ⅰ. Selelekela sa motheo sa di-abrasives tsa taemane
Li-abrasives tsa taemane kethepa e phofshoana kapa e nang le granular e entsoe ka ho sila, ho hlahloba le ho hlwekisa litaemane tsa tlhaho kapa litaemane tsa maiketsetso. Bothata ba eona ba Mohs bo fihla boemong ba 10, e leng bokhopo bo tsebahalang ka ho fetisisa. Ha bo bapisoa le li-abrasives tsa setso tse kang aluminium oxide le silicon carbide, li-abrasives tsa taemane li na le bokhoni bo phahameng ba ho seha le ho hanyetsa ho tsofala, 'me li ka sila le ho bentša thepa e thata haholo ka katleho e phahameng le tšenyo e tlase.
Li-abrasives tsa daemane li kenyelletsa haholo-holo mefuta e latelang:
Phofo e nyenyane ea taemane: Boholo ba dikarolwana bo tloha ho mashome a di-micron ho isa ho di-nanometer, tse loketseng ditshebetso tse fapaneng tsa ho bentsha ka nepo e phahameng.
Lebili la taemane la ho sila/hlooho ea ho sila: e sebelisetsoa ho sila le ho bopa thepa e thata.
Lehare/sekotoana sa saga sa taemane: se sebelisetsoa ho seha le ho tjheka thepa e kang lejwe, letsopa, khalase, jj.
Setlolo sa ho sila sa taemane/setlolo sa ho bentša: se sebelisoa haholo ts'ebetsong e nepahetseng haholo liindastering tsa elektroniki, tsa optics, tsa hlobo le tse ling.
Thepa ea taemane e kopantsoeng (PCD/PCBN): e kopanya taemane le matrix ea tšepe kapa ea ceramic ho etsa thepa ea lisebelisoa tse kopantsoeng tse nang le ho tiea le ho hanyetsa ho tsofala.
Ⅱ. Masimo a tshebediso ya di-abrasives tsa taemane
1. Ts'ebetso ea mechini
Di-abrasives tsa daemane di sebediswa haholo ho bopeng le ho sileng thepa e thata haholo, jwalo ka carbide e samentetsweng, ceramics, silicon carbide, khalase, ferrite, jj. Ho sebedisa mabili a silang a daemane bakeng sa ho sebetsa ho ke ke ha ntlafatsa feela bokgoni ba ho sebetsa le boleng ba bokahodimo, empa hape ho ka eketsa bophelo ba sesebediswa le ho fokotsa makgetlo a ho fetoha ha sesebediswa. E loketse haholo bakeng sa ditshebetso tsa tlhahiso tse hlahiswang ka bongata, tse iketsahalletsang ka nepo e phahameng.
2. Liindasteri tsa elektroniki le tsa semiconductor
Nakong ea ts'ebetso ea thepa e kang li-wafer tsa silicon, li-substrate tsa safire, li-chips tsa silicon carbide, khalase ea optoelectronic, jj., lisakha tsa terata tsa daemane, maro a silang le li-paste tsa ho bentša ke lintho tsa bohlokoa tse sebelisoang. Li-abrasives tsa daemane li ka finyella ho batalla le ho ba thata ha boemo ba submicron kapa esita le nanometer. Li sebelisoa haholo lihokelong tsa bohlokoa tse kang ho betla li-chip, ho sila li-wafer le ho betla li-photomask. Ke ntlha ea bohlokoa ho netefatsa ts'ebetso e phahameng le chai e ngata ea lihlahisoa tsa elektroniki.
3. Ts'ebetso ea mahlo
Phofo ea daemane e sebelisoa haholo ho bents'eng khalase ea optical, lifensetere tsa laser, lilense tsa safire le likarolo tse ling. Matla a eona a ho seha a matle le botsitso ba lik'hemik'hale li ka ntlafatsa boleng ba ts'ebetso ea seipone ka katleho le ho fihlela Ra ea bokaholimo bo ka tlase ho 10nm. Ke thepa ea bohlokoa bakeng sa ho fihlela libaka tse boreleli haholo le phetisetso e phahameng ea leseli.
4. Kaho le ts'ebetso ea majoe
Mahare a sakha ea taemane, likotoana tsa ho phunya, lithapo tsa ho seha, jj. li sebelisoa haholo ts'ebetsong ea thepa ea kaho e kang granite, 'mabole le konkreite. Ha li bapisoa le lisebelisoa tsa setso, lisebelisoa tsa taemane li phahame ka lebelo la ho seha, bophelo ba ts'ebeletso, le boleng ba ho seha, 'me li loketse haholo ts'ebetsong e sebetsang ea thepa ea kaho e matla le e nang le bongata bo boholo.
5. Matla a macha le sefofane
Ka nts'etsopele ea theknoloji e ncha ea matla, tlhoko ea li-abrasives tsa daemane ts'ebetsong ea likotoana tsa lipalo tsa betri ea lithium, li-diaphragm tsa ceramic, likarolo tsa likoloi tsa motlakase, jj. e ntse e hola ka potlako. Lefapheng la lifofane, lisebelisoa tsa daemane li sebelisoa bakeng sa ho sebetsa ka nepo likarolo tse chesang tsa enjene, likarolo tsa sebopeho tse kopaneng, jj., e leng se ntlafatsang ts'epo le ho tšoarella ha lihlahisoa.
III. Qetello
Di-abrasives tsa daemane, e le thepa ea bohlokoa ea motheo bakeng sa tlhahiso ea indasteri ea sejoale-joale, li ntse li amoheloa ke maemo a ho sebetsa ka nepo haholoanyane ka lebaka la thepa ea tsona e ntle ea 'mele le ts'ebeliso e pharaletseng. Nakong e tlang, ka tsoelo-pele e tsoelang pele ea saense ea thepa le theknoloji ea tlhahiso, li-abrasives tsa daemane li tla tsoela pele ho hola ka tsela e ntlafalitsoeng haholoanyane, e bohlale le e mosa tikolohong, e thusang indasteri ea tlhahiso ea maemo a holimo ho ea boemong bo holimo.